Diamond Micropowder
Applications: Metal matrix materials with high thermal conductivity and low expansion coefficient, such as diamond-copper composites and liquid metal thermal interface materials.Product Features:Metal coating on particle surface with strong bonding force and uniform coating; coating thickness controllable from 0.05 to 2 μm.Wide available particle size range: 10~300 μm.Single crystal morphology, minimal defects and low impurity content.
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