[Introduction] With the rapid iteration of electronic devices towards high power, high density, and miniaturization, traditional thermal grease can no longer meet the heat dissipation needs of high heat flux devices. As a cutting-edge new material included in the national "Guidelines for the First Batch of Application Demonstration of Key New Materials", liquid metal thermal paste, relying on its thermal conductivity far exceeding that of traditional thermal grease and stable physical and chemical properties, is gradually penetrating into many core fields such as high-performance computing, automotive electronics, and industrial manufacturing, becoming a key support for promoting industrial technological upgrading.
Liquid metal thermal paste takes low-melting-point alloys such as gallium-based, indium-based, and bismuth-based as the core components. It is in a stable paste state at room temperature, which can be evenly applied between heating devices and radiators, fill micro gaps and exclude air, and build a thermal conductive channel with extremely low thermal resistance. Its thermal conductivity can reach 5-10 times that of traditional thermal grease, and its high temperature resistance can reach up to 500℃. It also has the advantages of no volatilization, no drying, and safety and environmental protection, adapting to various harsh heat dissipation scenarios. At present, its application fields have achieved multi-dimensional expansion, covering many core tracks such as consumer electronics, industrial manufacturing, and high-end computing power, showing broad industrial application prospects.
In the field of high-performance computing (HPC) and AI, as chip power consumption continues to rise, heat dissipation efficiency has become a key bottleneck restricting the performance release of equipment. Relying on its excellent thermal conductivity, liquid metal thermal paste has become the core heat dissipation material for high-end computing power equipment. In CPUs, GPUs, AI accelerators, and edge computing devices, it can achieve atomic-level interface bonding, greatly reduce contact thermal resistance, keep the chip temperature stable during high-load operation, and avoid frequency reduction and downtime caused by overheating.
It is reported that NVIDIA's Rubin and Blackwell platforms have designated the liquid metal thermal conductivity solution as the standard configuration for 2300W-level GPUs. Its advantage of 70-75W/m·K thermal conductivity can support the stable operation of chips with power consumption exceeding 1000W, directly promoting the computing power breakthrough in fields such as supercomputing and AI training. At the same time, in data center servers, liquid metal thermal paste is compatible with copper-based or nickel-plated radiators, which can effectively solve the heat dissipation problems of server CPUs, PCHs, and high-power optical modules, providing guarantee for the efficient and stable operation of data centers.
With the acceleration of the intelligentization and electrification of automobiles, the power density of on-board electronic equipment such as ADAS main control modules, on-board computing platforms, and millimeter-wave radars is constantly increasing, and the requirements for heat dissipation reliability are becoming more and more stringent. Relying on good temperature adaptability and stability, liquid metal thermal paste has achieved large-scale application in the automotive electronics field, focusing on heat dissipation of high heat flux devices in non-power battery directions.
In the ADAS main control heat dissipation module, liquid metal thermal paste can quickly conduct the heat generated by the chip during operation to ensure the accurate response of the automatic driving system; in the on-board computing platform and millimeter-wave radar processing unit, its stable thermal conductivity can avoid equipment performance attenuation in high-temperature environments and ensure the all-weather reliable operation of the on-board electronic system. In addition, its characteristics of no volatilization and resistance to high and low temperatures are also compatible with the complex driving environment of automobiles, effectively extending the service life of on-board electronic equipment.
In the field of industrial production and power supply equipment, devices such as IGBT modules, high-power power supply modules, and industrial control systems operate in high-temperature and high-load conditions for a long time. Heat dissipation performance directly determines the operational stability and service life of the equipment. Relying on the advantages of high thermal conductivity and low thermal resistance, liquid metal thermal paste can effectively solve the heat dissipation pain points of such high-power devices and become the preferred material for thermal management in the industrial field.
In IGBT modules, liquid metal thermal paste can quickly conduct the heat generated by the module during operation to the radiator, reduce the thermal stress of the module, and avoid module damage caused by overheating; in high-power power supply modules and industrial control systems, its stable thermal conductivity can ensure that the equipment maintains stable temperature during long-term high-load operation and reduce the incidence of failures. At the same time, its characteristics of reusability and low after-sales cost also reduce the maintenance cost of industrial equipment and improve production efficiency.
In the consumer electronics field, with the popularization of products such as e-sports hosts, high-power fast charging modules, and high-density portable computing equipment, consumers' demand for equipment performance and portability is constantly improving. Traditional thermal conductive materials can no longer balance the needs of heat dissipation efficiency and equipment miniaturization. The emergence of liquid metal thermal paste provides a new solution for heat dissipation of consumer electronics.
In e-sports hosts, liquid metal thermal paste can effectively reduce the operating temperature of CPUs and GPUs, allowing the equipment to maintain high-performance output during full-load operation and improve the gaming experience; in high-power fast charging modules, its rapid thermal conductivity can avoid overheating of the equipment during charging and ensure charging safety; in high-density portable computing equipment, its paste characteristics can adapt to narrow installation spaces, achieving efficient heat dissipation without increasing the equipment volume, helping the equipment upgrade towards thinness, lightness, and high performance. In addition, indium-based liquid metal thermal paste has gradually opened up the mainstream consumer electronics market by virtue of its advantages such as high reliability and long service life.
In addition to the civilian field, liquid metal thermal paste also plays an important role in special fields such as aerospace and military industry. In aerospace electronic equipment, its characteristics of resistance to extreme temperatures and no volatilization can adapt to the complex temperature environment in space, providing reliable heat dissipation guarantee for electronic devices in satellites and spacecraft; in the military field, its efficient thermal conductivity can be applied to high-end equipment such as military lasers, radar systems, and electromagnetic guns, solving the heat dissipation problem of high heat flux devices and improving the combat performance and stability of the equipment.
[Conclusion] At present, with the development of the thermal management industry towards high efficiency and refinement, the application scenarios of liquid metal thermal paste are still continuing to expand. Insiders said that in the future, with the continuous optimization of material preparation technology, liquid metal thermal paste will gradually overcome the corrosion problem of aluminum substrates, reduce production costs, further penetrate into more emerging fields, and at the same time promote the iterative upgrading of thermal management technology, injecting new momentum into the high-quality development of various industries. It is reported that at present, some enterprises have realized the large-scale production of liquid metal thermal paste, formed a complete product matrix, which can meet the customized needs of different fields, and promoted the liquid metal industry to enter a new stage of large-scale application.
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